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The Vacuum Hot Plate Soldering Method to Reduce Voids in Solder Joints
The electronics industry has remarkably evolved. The new technology of power film resistors has helped shrink equipment size and minimize cost. The manufacturing parameters that affect power resistors’ key capabilities are the temperature coefficient of resistant, long-term stability, and humidity resistance. Since voids are widely associated with reliability and performance issues, this project focuses on refining power film resistor manufacturing process in order to minimize the voids that occur within the solder joints during the soldering process. In order to do so, vacuum hot plate soldering is investigated as an alternate manufacturing technique. The present study is intended to demonstrate that the vacuum hot plate soldering method is a strong candidate for manufacturing power film resistors. For this purpose, the research presented below will seek to illustrate how the performance, the long-term reliability, and the manufacturing of the resistors can be improved, with this new process. This study will show how using the vacuum hot plate method reduces voids in the solder joints of the power film resistors. Also, it will show how resistors produced with the vacuum hot plate method have a stable temperature coefficient of resistance and preform well during load life and humidity testing. These results will compared to other soldering methods as well as competitor parts.
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